TSMC Obtains Government Approval for 0.13-micron Process Upgrade in China
September 30, 2010
Taiwan's Investment Commission under MOEA (Ministry of Economic Affairs) has approved the application file by TSMC (Taiwan Semiconductor Manufacturing) to upgrade its technology used in the company's Songjiang 8-inch wafer fab from 0.18-micron process to 0.13-micron process, according to a September 30, 2010 report by the Commercial Times of Taiwan. It is reported that TSMC's Songjiang fab, located in Shanghai, currently makes 45,000 wafers per month. TSMC plans to inject US$225 million into the Songjiang fab, aiming to boost its monthly capacity to 50,000 wafers by the end of 2010 and 60,000 wafers by 2011.